【Principle】
Control the viscosity of the adhesive film to the customer's demand, and it is still easy to peel off after the process without residual glue.
【Application】
Wafer grinding, cutting and flipping process
Ceramic chip cutting process
Soft plate anti-plating
【Features】
1. Specially used for wafer die cutting in LED and semiconductor industries.
2. The quality characteristics are comparable to Japanese products after testing by major manufacturers.
3. Special adhesive formula, moderate adhesion, no residual glue after processing.
4. Applicable to LED die flip process, no die loss phenomenon.
5. The film is flat, soft and easy to expand and take out.
The material structure and bonding characteristics can be adjusted according to customer needs.
【Blue film spec. table】
Project |
PL080B |
PL024B |
PL080W |
PL024W |
Test Methods |
Color |
BLUE TAPE |
BLUE TAPE |
WHITE TAPE |
WHITE TAPE |
ASTM D1000 |
Thickness(mm) ±0.015 |
0.075 |
0.075 |
0.075 |
0.075 |
|
Adhesion N/20mm |
0.2~0.6 |
0.6~1.0 |
0.2~0.6 |
0.6~1.0 |
ASTM D3330 |
Peel strength N/20mm |
0.10~0.20 |
0.25~0.35 |
0.10~0.20 |
0.25~0.35 |
ASTM D3330 |
Breaking strength N/20mm |
15 |
15 |
15 |
15 |
ASTM D3759 |
Breaking strength elongation% |
200 |
200 |
200 |
200 |
ASTM D3759 |
